Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Cham: Springer International Publishing, Imprint: Springer, 2019
Online
Sammelwerk, Elektronische Ressource
- 1 Online-Ressource (XX, 279 p. 175 illus., 122 illus. in color)
Ermittle Ausleihstatus...
Titel: |
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
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Verantwortlichkeitsangabe: | edited by Kim S. Siow |
Autor/in / Beteiligte Person: | Siow, Kim S. |
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Veröffentlichung: | Cham: Springer International Publishing, Imprint: Springer, 2019 |
Medientyp: | Sammelwerk |
Datenträgertyp: | Elektronische Ressource |
Umfang: | 1 Online-Ressource (XX, 279 p. 175 illus., 122 illus. in color) |
ISBN: | 9783319992563 |
DOI: | 10.1007/978-3-319-99256-3 |
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